Description
The NVIDIA Jetson AGX Orin Industrial module delivers up to 248 TOPs of AI performance for embedded industrial applications with power configurable between 15W and 75W. It’s form-factor and pin-compatible with Jetson AGX Orin, and gives you more than 8X the performance of Jetson AGX Xavier Industrial.
This system-on-module supports multiple concurrent AI application pipelines with an NVIDIA Ampere architecture GPU, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. It comes with extended temperature range, operating lifetime, and shock and vibration specifications, as well as support for Error Correction Code (ECC) memory. This makes it ideal for industrial-grade AI products. Plus, the module includes hardware root of trust, secure boot,hardware accelerated cryptography, support for encrypted storage and memory, and other security features to protect your deployments.
Additional information
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores |
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Max GPU Freq | 1.2GHz |
CPU Max Freq | 2 GHz |
DL Accelerator | 2x NVDLA v2.0 |
Vision Accelerator | PVA v2.0 |
Memory | 64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC) |
Storage | 64GB eMMC 5.1 |
PCIE | 2 x8 + 1 x4 + 2 x1 22 lanes PCIe Gen 4 |
CSI Camera | 16 lanes MIPI CSI-2 (16 virtual channels) D-PHY 2.1 40Gbps/ C-PHY 2.0 164Gbps |
Video Encode | 1x 4K60 | 3x 4K30 | 7x 1080p60 | 15x 1080p30 (H.265) H.264, AV1 |
Video Decode | 1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60 | 23x 1080p30 (H.265) H.264, VP9, AV1 |
Display | 1 multi-mode (8K60, 2x 4K60) DP1.4a (+ MST)/HDMI2.1/eDP 1.4 |
Networking | 1x GbE |
USB | 3x USB 3.2 gen2 + 4x USB 2.0 |
Other I/O | 4x UART 3x SPI | 4x I2S | 8x I2C | 2X CAN | PWM | DMIC | DSPK | GPIOs |
Power | 15W-75W |
Mechanical | 100mm x 87mm 699-pin Integrated Thermal Transfer Plate |
Mechanical Shock | 50G Operational |
Vibration | 5G Operational |
Temperature | -40°C to 85°C at the TTP Surface |
Temperature Endurance | -40°C to 85°C |
Temperature Humidity Biased | 85°C/85% RH |
Underfill | SoC corner bonding |
Error-correcting code (ECC) | DRAM ECC supported |
Brand
NVIDIA
Jetson AGX Orin Industrial Module Datasheet
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