NVIDIA Official Embedded Compute Distributor (MEA)
الموزع الرسمي للحوسبة المدمجة من NVIDIA (الشرق الأوسط وأفريقيا)
Официальный дистрибьютор встроенных вычислительных систем NVIDIA (MEA)
NVIDIA Resmi Gömülü Sistem Distribütörü (MEA)
NVIDIA Official Embedded Compute Distributor (MEA)
الموزع الرسمي للحوسبة المدمجة من NVIDIA (الشرق الأوسط وأفريقيا)
Официальный дистрибьютор встроенных вычислительных систем NVIDIA (MEA)
NVIDIA Resmi Gömülü Sistem Distribütörü (MEA)

NVIDIA IGX T5000

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High-performance System-on-Module (SoM) designed for industrial, medical, and mission-critical AI applications, featuring the NVIDIA Blackwell GPU architecture, a 14-core Arm® Neoverse® V3AE CPU, and 128 GB LPDDR5X memory.

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Description

NVIDIA IGX T5000 is a modular System-on-Module (SoM) designed for the most demanding industrial, medical, and mission-critical edge computing (Edge AI) applications, combining high performance with exceptional reliability. Powered by the latest NVIDIA Blackwell GPU architecture, a 14-core Arm® Neoverse® V3AE processor, and a massive 128 GB of LPDDR5X memory, the IGX T5000 delivers groundbreaking compute performance for AI workloads.

Key Technologies and Benefits

1. NVIDIA Blackwell Architecture and Revolutionary Artificial Intelligence (AI)

  • 5th-Generation Tensor Cores: Advanced AI cores with hardware support for FP4, FP8, FP16, bfloat16, TF32, and INT8 formats.
  • Sparse Computing Performance: With AI performance reaching up to 2070 TFLOPS FP4 and 1035 TFLOPS FP8, complex Large Language Models (LLMs) and deep learning inference workloads can be executed at the edge within milliseconds.
  • Transformer Engine: Accelerates deep learning and Transformer models directly at the hardware level, maximizing power efficiency and inference performance.
  • Multi-Instance GPU (MIG): Enables the GPU to be partitioned into physically isolated instances, allowing mission-critical workloads and general-purpose applications to run securely and independently on the same module.

2. Advanced CPU Architecture and High Memory Bandwidth

  • 14-Core Arm® Neoverse® V3AE: A 64-bit processor complex with a maximum operating frequency of up to 2.6 GHz, providing an excellent foundation for parallel data processing, multitasking, and complex system management.
  • 128 GB LPDDR5X Memory: With a 256-bit memory bus and massive memory bandwidth of up to 273 GB/s, multiple high-resolution camera streams and large datasets can be processed smoothly without bottlenecks.

3. Hardware-Level Safety for Mission-Critical Applications: Functional Safety Island (FSI)

  • Includes an integrated Functional Safety Island (FSI) to support compliance with industrial and medical safety standards.
  • With 4 Cortex-R52 safety cores operating in Dual-Core Lock-Step (DCLS) mode and a Hardware Security Module (HSM), system monitoring and fault management can be performed with high reliability without requiring an external MCU

4. Advanced Image Processing, Video, and Sensor Support

  • Advanced Camera Support: Supports up to 32 camera data streams through a 16-lane MIPI CSI-2 interface (164 Gbps with C-PHY v2.1 / 40 Gbps with D-PHY v2.1) and Virtual Channels. It also enables connectivity for up to 20 cameras via the Holoscan Sensor Bridge (HSB).
  • Advanced Hardware Accelerators:
    • 2x NVDEC / 2x NVENC: Real-time hardware-accelerated video decoding and encoding for 8K30 and multiple 4K60 streams.
    • PVA v3.0 (Programmable Vision Accelerator): A dedicated vector processor that handles computer vision and sensor data processing workloads, reducing the load on the GPU.
    • Optical Flow Accelerator (OFA): Hardware acceleration for depth perception (Stereo Disparity) and motion tracking.

5. Flexible and High-Speed Connectivity Interfaces (I/O)

  • PCIe Gen 5: Supports up to 8 lanes of PCIe Gen 5, enabling ultra-high-speed data transfer with NVMe storage devices and external expansion cards.
  • Ultra-High-Speed Networking: Integrated Multi-Gigabit Ethernet (MGBE) controllers provide 4x 25 GbE and 1x 1 GbE network interfaces.
  • Rich Industrial Connectivity: 3x USB 3.2 Gen 2 (10 Gbps), 4x USB 2.0, 4x CAN bus, 4x UART, 13x I2C, 3x SPI, and HDMI 2.1 / DisplayPort 1.4a display outputs.

6. Industrial-Grade Durability and Thermal Design

  • 24/7 Continuous Operation: Designed for uninterrupted industrial operations with an operating lifetime of up to 10 years.
  • Integrated TTP and Heatpipe: The integrated Thermal Transfer Plate (TTP) and heatpipe system enable easy integration of external active or passive cooling solutions.
  • Temperature Durability: Wide operating temperature range from -40°C to 118°C (Tj).

Use Cases

  • Medical Devices & Surgical Robotics: Real-time AI-powered imaging, ultrasound/endoscopy analysis, and ultra-low-latency intervention systems.
  • Autonomous Mobile Robots (AMRs) & AGVs: Multi-camera/LiDAR data processing, hardware-accelerated depth mapping, and route planning in factories and logistics centers.
  • Industrial Quality Control & Automation: Product defect detection and object classification using high-speed, multi-camera streams on production lines.
  • Smart Cities & Security: Edge computing analytics systems capable of simultaneously processing 8K and multiple 4K video streams.

Specifications

ModelNVIDIA IGX T5000
AI Performance2070 TFLOPS (FP4 — Sparse) / 1035 TFLOPS (FP8 — Sparse)
GPU2560 CUDA Cores, NVIDIA Blackwell Architecture, 5th-Generation Tensor Cores, MIG (Multi-Instance GPU) Support
GPU Maximum Frequency1.575 GHz (MAXN Mode) / 1.386 GHz (120W Mode)
CPU14-Core Arm® Neoverse®-V3AE 64-bit CPU
• 64 KB I-Cache, 64 KB D-Cache (per core)
• 1 MB L2 Cache (per core)
• 16 MB Shared L3 / System Cache
CPU Maximum Frequency2.6 GHz
Vision Accelerator1x PVA v3.0 (Programmable Vision Accelerator)
Memory128 GB 256-bit LPDDR5X (273 GB/s Memory Bandwidth)
Storage• NVMe Support via PCIe
• SSD Support via USB 3.2
• UFS-III (2-Lane) Support
Video Encode2x NVENC:
• 6x 4Kp60 (H.265 / H.264 UHP)
• 12x 4Kp30 (H.265)
• 26x 1080p60 (H.265)
• 54x 1080p30 (H.265)
• 48x 1080p30 (H.264)
Video Decode2x NVDEC:
• 4x 8Kp30 (H.265)
• 10x 4Kp60 (H.265)
• 20x 4Kp30 (H.265)
• 40x 1080p60 (H.265)
• 82x 1080p30 (H.265)
Camera (Video Input)• Up to 20 Cameras via HSB (Holoscan Sensor Bridge)
• 16-Lane MIPI CSI-2 (up to 32 Cameras with Virtual Channels)
• C-PHY 2.1 (10.25 Gbps per Trio / 164 Gbps Total)
• D-PHY 2.1 (40 Gbps)
PCIeUp to 8 Lanes of PCIe Gen 5 (Root Port Mode: C1 x1, C2 x1, C3 x2, C4 x8, or C5 x4)
USBxHCI Host Controller with Integrated PHY:
• 3x USB 3.2 Gen2x1 (10 Gbps)
• 4x USB 2.0
Networking (Ethernet)4x 25 GbE (MGBE) + 1x 1 GbE (ETHER_QOS)
Display Output2x Shared HDMI 2.1 / VESA DisplayPort 1.4a (up to 8K30 with HBR3 and MST Support)
Other I/O Interfaces5x I2S / 2x Audio Hub (AHUB), 1x DMIC, 4x UART, 4x CAN, 3x SPI, 13x I2C, 6x PWM Outputs
Power ConsumptionPower Modes: 75W / 95W / 120W (Default) / MAXN (Maximum Module Power — TMP: 130W)
Dimensions & Mechanical• 87 mm × 100 mm × 15.29 mm
• 699-pin B2B Molex Mirror Mezz Connector
• Integrated Thermal Transfer Plate (TTP) and Heatpipe

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