Açıklama
Nuvo-8208GC is the world’s first dual GPU edge ai platform with industrial-grade design and in-vehicle features. Designed specifically to support two highend 250W NVIDIA® graphics cards, it offers tremendous GPU power up to 28 TFLOPS in FP32 for emerging GPU-accelerated edge computing, such as autonomous driving, vision inspection and surveillance/ security.
Nuvo-8208GC edge AI computing platform is powered by Intel® Xeon® E or 8th-Gen Core™ 6-core/ 12-thread CPUs coupled with workstation-grade Intel® C246 chipset to support up to 128 GB ECC or non-ECC DDR4 memory. The system incorporates two hot-swappable 2.5″ trays for easy HDD/ SSD replacement and an M.2 2280 NVMe socket for the ultimate disk performance. Its front-accessible GbE and USB 3.1 Gen1/ Gen2 ports feature screw-lock mechanisms for securing cable connections. In addition to the dual x16 PCIe slots for GPU installation, Nuvo-8208GC has two other x8 PCIe slots and one x4 PCIe slot for expansion cards to extend function sets like data collection, analytics and communication.
Nuvo-8208GC has a brand new power delivery design to accept 8~ 48V wide-range DC input and to handle heavy power requirements from dual 250W GPUs. Along with built-in ignition control, it’s feasible to deploy it on a vehicle and directly power it via the car’s power system. Mechanical wise, Nuvo-8208GC incorporates Neousys’ patented heat dissipation design*, damping brackets* and patent-pending GPU press bar, making it steady and rock-solid in various conditions.
The Nuvo-8208GC is Neousys’ response to the never-ending demand of TFLOPS in industrial GPU platforms. With industrial-grade power, thermal and mechanical design, it pushes versatile edge AI inference applications from laboratories to field applications, where reliability matters.
Özellikler
| System Core |
|---|
| Processor | Supporting Intel® Xeon® E and 8th-Gen CPU (LGA1151 socket)
– Intel® Xeon® Processor E-2176G
– Intel® Xeon® Processor E-2124G
– Intel® Core™ i7-8700/ i7-8700T
– Intel® Core™ i5-8500/ i5-8500T |
|---|
| Memory | Up to 128 GB ECC/ non-ECC DDR4 2133 SDRAM (four SODIMM slots) |
|---|
| Graphics | Independent GPU via x16 PEG port, or integrated Intel® UHD Graphics 630 |
|---|
| Chipset | Intel® C246 platform controller hub |
|---|
| AMT | Supports AMT 12.0 |
|---|
| TPM | Supports TPM 2.0 |
|---|
| I/O Interface |
|---|
| Ethernet | 1x Gigabit Ethernet port by Intel® I219-LM
1x Gigabit Ethernet port by Intel® I210-IT |
|---|
| Native Video Port | 1x VGA connector, supporting 1920 x 1200 resolution
1x DVI-D connector, supporting 1920 x 1200 resolution
1x DisplayPort connector, supporting 4096 x 2304 resolution |
|---|
| Serial Port | 2x software-programmable RS-232/ 422/ 485 ports (COM1/ COM2) |
|---|
| USB | 4x USB 3.1 Gen2 (10 Gbps) ports
4x USB 3.1 Gen1 (5 Gbps) ports
1x USB 2.0 ports (internal for dongle use) |
|---|
| Audio | 1x Speaker-out |
|---|
| Expansion Bus/ Internal I/O Interface |
|---|
| PCI Express | 2x PCIe x16 slot@Gen3, 8-lanes
2x PCIe x8 slots@Gen3, 4-lanes
1x PCIe x4 slot@Gen3, 1-lane |
|---|
| M.2 | 1x M.2 2242 B key socket supporting dual SIM mode with selected M.2 LTE module |
|---|
| mini-PCIe | 2x full-size mini PCI Express socket |
|---|
| Storage Interface |
|---|
| SATA | 2x hot-swappable HDD trays for 2.5″ HDD/ SSD installation |
|---|
| M.2 | 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation |
|---|
| mSATA | 2x full-size mSATA port (mux with mini-PCIe) |
|---|
| Power Supply |
|---|
| DC Input | 2x 4-pin pluggable terminal block for 8~35V DC input and 1x 3-pin ignition control |
|---|
| Mechanical |
|---|
| Dimension | 225 mm (W) x 360 mm (D) x 186 mm (H) |
|---|
| Weight | 8.6 Kg |
|---|
| Mounting | Wall-mount with damping brackets |
|---|
| Environmental |
|---|
| Operating Temperature | -25°C ~ 60°C with 100% CPU/ GPU loading **/*** |
|---|
| Storage Temperature | -40°C ~ 85°C |
|---|
| Humidity | 10%~90% , non-condensing |
|---|
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
|---|
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
|---|
| EMC | CE/ FCC Class A, according to EN 55024 & EN 55032 |
|---|
* The CPU and GPU loading are applied using Passmark® BurnInTest 8.0 with 35 TDP CPU. Operating Temperature degrades with higher TDP CPU. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is
